Microsoft to cheat the heat off Xbox 360 CPU with die shrink
Vikas Shekhawat | Apr 24 2006

It seems that the upcoming Sony’s PS3 has already started giving some heat to Microsoft, though we’ll know that the Xbox 360 is troubling us with overheating problems ultimately leading to shutting down and component breakdown. To cheat the heat, Microsoft is planning to switch over to a version of the Xenon CPU embellished with a 65nm die process, as early as Jan 2007.



The CPUs will be manufactured by Chartered Semiconductor in Singapore, under license from IBM and Microsoft. The cooling effect created by the new CPU will no doubt affect the performance of the Xbox 360 especially while running graphics-intensive games. Sony has not yet declared the prices of the new PS3 but Microsoft can have an upper edge by pitching the 360 at lower prices and a cooler new one will definitely trigger the consol war.



Via: arstechnica

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